Wakefield
Canada
12
2013-05-09
The entities that hold a legal rights for patent applications filed by inventor Brown Paul James:
Paul James Brown from Wakefield, CA has applied for patents for these inventions. The list has both pending applications and granted patents:
Thermal warp compensation IC package
#2 | 2013-03-14In-grid on-device decoupling for BGA
#3 | 2012-07-05Land pattern for 0201 components on a 0.8 mm pitch array
#4 | 2012-04-05THERMAL WARP COMPENSATION IC PACKAGE
#5 | 2012-04-05Warp reactive IC package
#6 | 2008-09-18Emergency alert system enhancement using alert server and metro ATM network for DSL deployment
#7 | 2008-09-18Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid
#8 | 2008-08-28In-grid decoupling for ball grid array (BGA) devices
#9 | 2008-01-17Printed circuit board thickness adaptors
#10 | 2007-03-15Area array routing masks for improved escape of devices on PCB
#11 | 2007-02-15Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid
#12 | 2007-02-15Using rows/columns of micro-vias to create PCB routing channels in BGA interconnect grid (micro-via channels)
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