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Inventor profile of:

Min-Jer Wang

City:

Hsinchu

Country:

Taiwan

Published Applications:

7

Last publication date:

2021-02-04

Top Assignees for applications by Min-Jer Wang

The entities that hold a legal rights for patent applications filed by inventor Wang Min-Jer:

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 6 Hsinchu, Taiwan
  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 1 Hsin-Chu, Taiwan

Recent patent applications by Wang Min-Jer

Min-Jer Wang from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-02-04
US20210033663A1
Physics

INTEGRATED CIRCUIT TESTING SYSTEM AND METHOD

#2 | 2021-01-14
US20210013748A1
Electricity

Composite integrated circuits and methods for wireless interactions therewith

#3 | 2019-11-07
US20190339324A1
Physics

Bump ball testing system and method

#4 | 2019-05-09
US20190140488A1
Electricity

Composite integrated circuits and methods for wireless interactions therewith

#5 | 2017-08-24
US20170242071A1
Physics

Composite integrated circuits and methods for wireless interactions therewith

#6 | 2016-12-01
US20160349313A1
Physics

Bump ball testing system and method

#7 | 2015-11-12
US20150323589A1
Physics

Composite integrated circuits and methods for wireless interactions therewith

InventorID:

1354656 ⎘

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