🔗 Permalink

Inventor profile of:

Hideki WATANABE

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2024-08-08

Top Assignees for applications by Hideki WATANABE

The entities that hold a legal rights for patent applications filed by inventor WATANABE Hideki:

Panasonic Intellectual Property Management Co., Ltd. 5 Osaka, Japan
SEKISUI HOUSE, LTD. 3 Osaka-shi, Osaka, Japan
SEKISUI HOUSE, LTD. 3 Osaka, Japan
Panasonic Intellectual Property Management Co., Ltd. 1 Kadoma-shi, Japan
MIYAGAWA KASEI INDUSTRY CO., LTD. 1 Osaka-shi, Japan
Maruho Co., Ltd. 1 Osaka-shi, Osaka, Japan
MATSUSHITA ELECTRIC WORKS, LTD. 1 Osaka, Japan
The University of Tokyo 1 Tokyo, Japan
PANASONIC CORPORATION 1 Osaka, Japan
HERAEUS ELECTRO-NITE JAPAN, LTD. 1 Takatsuki-shi, Japan
UNIVERSITY OF FUKUI 1 Fukui-shi, Fukui, Japan
MARUHO CO., LTD. 1 Osaka, Japan

Recent patent applications by WATANABE Hideki

Hideki WATANABE from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-08-08

US20240263466A1

Fixed constructions

ANCHOR SUPPORT TOOL AND FORM SET FOR FOUNDATION

#2 | 2024-07-25

US20240247457A1

Fixed constructions

FOUNDATION CONSTRUCTION METHOD AND ANCHOR SUPPORT

#3 | 2024-05-23

US20240170942A1

Electricity

Protection system

#4 | 2024-04-11

US20240117926A1

Mechanical engineering

ANCHOR SUPPORT MEMBER

#5 | 2024-03-14

US20240084020A1

Chemistry; metallurgy

INHIBITOR OF FIBROSIS PROGRESSION

#6 | 2022-11-03

US20220347093A1

Human necessities

PHARMACEUTICAL COMPOSITION

#7 | 2022-05-19

US20220158433A1

Electricity

Protection system

#8 | 2021-12-09

US20210383985A1

Electricity

RELAY MODULE

#9 | 2021-10-21

US20210327670A1

Electricity

ELECTRONIC COMPONENT MODULE

#10 | 2019-11-21

US20190355536A1

Electricity

Contact device, electromagnetic relay and electrical device

#11 | 2015-11-12

US20150325399A1

Electricity

Contact device

#12 | 2015-11-12

US20150325390A1

Electricity

Contact device

#13 | 2009-11-26

US20090289132A1

Performing operations; transporting

Electrostatically atomizing device and electrostatically atomizing system

#14 | 2006-09-14

US20060201806A1

Physics

Method of forming thin film layer on external surface of sensor and sensor manufactured therewith

InventorID:

1356366 ⎘