Daisuke MASAKI

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2024-08-01

Top Assignees for applications by Daisuke MASAKI

The entities that hold a legal rights for patent applications filed by inventor MASAKI Daisuke:

Daisuke MASAKI from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

RESIN COMPOSITION AND PRODUCTION METHOD THEREOF, AND CLEANING METHOD OF RESIN MOLDING PROCESSING MACHINE

Heat-shrinkable laminate film

Cover tape, method for manufacturing cover tape, and electronic part package

SEALING RESIN SHEET

InventorID:

1366783 ⎘