Eiki Oosawa

City:

Kanagawa

Country:

Japan

Published Applications:

Last publication date:

2013-03-14

Top Assignees for applications by Eiki Oosawa

The entities that hold a legal rights for patent applications filed by inventor Oosawa Eiki:

Eiki Oosawa from Kanagawa, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Head-gimbal assembly with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge

CONNECTING ELECTRICAL PARTS

Method and apparatus for manufacturing a head-gimbal assembly

Apparatus for interconnecting connection pads of a head-gimbal assembly and manufacturing method for the head-gimbal assembly

Head gimbal assembly, slider, and method of manufactuing a head gimbal assembly with reduced lead length

InventorID:

136777 ⎘