Mi Ja HAN

City:

Suwon

Country:

South Korea

Published Applications:

Last publication date:

2015-12-03

Top Assignees for applications by Mi Ja HAN

The entities that hold a legal rights for patent applications filed by inventor HAN Mi Ja:

Mi Ja HAN from Suwon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

PACKAGE SUBSTRATE, PACKAGE, PACKAGE ON PACKAGE AND MANUFACTURING METHOD OF PACKAGE SUBSTRATE

Printed circuit board and printed circuit board for camera module

InventorID:

1371438 ⎘