Inventor profile of:

Wei-Yan Shih

City:

Plano, Texas

Country:

United States

Published Applications:

26

Last publication date:

2022-01-13

Top Assignees for applications by Wei-Yan Shih

The entities that hold a legal rights for patent applications filed by inventor Shih Wei-Yan:

Recent patent applications by Shih Wei-Yan

Wei-Yan Shih from Plano, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-01-13
US20220011177A1
Physics

Piezoelectric thin-film sensor and use thereof

#2 | 2021-12-16
US20210389174A1
Physics

Piezo-electric sensor reset

#3 | 2020-05-28
US20200168786A1
Electricity

Differential sensor using thin-film piezoelectric capacitors

#4 | 2019-11-07
US20190339806A1
Physics

Piezoelectric sensor apparatus

#5 | 2019-05-30
US20190162590A1
Physics

Piezo-electric sensor reset

#6 | 2019-02-14
US20190051812A1
Electricity

Piezoelectric sensing apparatus and method

#7 | 2018-08-16
US20180231423A1
Physics

Piezoelectric thin-film sensor and use thereof

#8 | 2017-08-03
US20170217759A1
Performing operations; transporting

Wafer level packaging of MEMS

#9 | 2017-05-04
US20170123548A1
Physics

Integrated force sensing element

#10 | 2017-02-02
US20170033072A1
Electricity

Printed interconnects for semiconductor packages

#11 | 2017-02-02
US20170028439A1
Performing operations; transporting

Extended range ultrasound transducer

#12 | 2016-11-10
US20160329183A1
Electricity

MOTION SENSING POWER SWITCH

#13 | 2016-03-31
US20160093525A1
Electricity

Printed interconnects for semiconductor packages

#14 | 2016-02-25
US20160052781A1
Performing operations; transporting

Wafer level packaging of MEMS

#15 | 2015-08-13
US20150226618A1
Physics

Piezoelectric thin-film sensor

#16 | 2015-07-23
US20150205098A1
Physics

Low cost window production for hermetically sealed optical packages

#17 | 2013-03-14
US20130064400A1
Electricity

Silicon microphone with integrated back side cavity

#18 | 2012-02-16
US20120036695A1
Physics

Low cost window production for hermetically sealed optical packages

#19 | 2011-06-30
US20110158439A1
Electricity

Silicon microphone transducer

#20 | 2011-06-30
US20110156179A1
Electricity

Silicon microphone with integrated back side cavity

#21 | 2009-10-29
US20090267223A1
Electricity

MEMS package having formed metal lid

#22 | 2009-06-04
US20090140757A1
Physics

Microdisplay assemblies and methods of packaging microdisplays

#23 | 2009-05-21
US20090128481A1
Physics

Integrated system with computing and imaging capabilities

#24 | 2008-04-03
US20080080077A1
Physics

Low cost window production for hermetically sealed optical packages

#25 | 2006-09-12
US10331495
-

Split beam micromirror

#26 | 2005-07-07
US20050146771A1
Physics

Active border pixels for digital micromirror device

InventorID:

137724 ⎘