Seiersberg
Austria
8
2022-11-03
Thomas BODNER from Seiersberg, AT has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD OF PRODUCING A SEMICONDUCTOR BODY WITH A TRENCH, SEMICONDUCTOR BODY WITH AT LEAST ONE TRENCH AND SEMICONDUCTOR DEVICE
#2 | 2019-08-013D-INTEGRATED OPTICAL SENSOR AND METHOD OF PRODUCING A 3D-INTEGRATED OPTICAL SENSOR
#3 | 2019-05-30Method of producing an optical sensor at wafer-level and optical sensor
#4 | 2018-11-08Optical package and method of producing an optical package
#5 | 2018-08-09Method of producing an optical sensor at wafer-level and optical sensor
#6 | 2018-03-29Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component
#7 | 2017-05-11Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component
#8 | 2015-12-03Method of producing a removable wafer connection and carrier for wafer support
1379709 ⎘