Marshall Maple

City:

Cupertino, California

Country:

United States

Published Applications:

Last publication date:

2017-05-04

Top Assignees for applications by Marshall Maple

The entities that hold a legal rights for patent applications filed by inventor Maple Marshall:

Marshall Maple from Cupertino, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Circuit package with internal and external shielding

VIA STRUCTURES FOR THERMAL DISSIPATION

Via structures for thermal dissipation

Hybrid power amplifier comprising heterojunction bipolar transistors (HBTs) and complementary metal oxide semiconductor (CMOS) devices

Hybrid power amplifier having electrical and thermal conduction path

Semiconductor structure comprising moisture barrier and conductive redistribution layer

InventorID:

1380507 ⎘