Daniel Edelstein

City:

Armonk, New York

Country:

United States

Published Applications:

Last publication date:

2016-09-22

Top Assignees for applications by Daniel Edelstein

The entities that hold a legal rights for patent applications filed by inventor Edelstein Daniel:

Daniel Edelstein from Armonk, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Ultrathin multilayer metal alloy liner for nano Cu interconnects

ULTRATHIN MULTILAYER METAL ALLOY LINER FOR NANO CU INTERCONNECTS

Ultrathin multilayer metal alloy liner for nano Cu interconnects

Ultrathin Multilayer Metal Alloy Liner for Nano Cu Interconnects

InventorID:

1388378 ⎘