Paul GONDCHARTON

City:

Grenoble

Country:

France

Published Applications:

Last publication date:

2018-10-18

Top Assignees for applications by Paul GONDCHARTON

The entities that hold a legal rights for patent applications filed by inventor GONDCHARTON Paul:

Commissariat A L'Energie Atomique Et Aux Energies Alternatives 8 Paris, France
COMMISSARIAT À L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES 3 Paris, France
COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES 1 Paris, France

Recent patent applications by GONDCHARTON Paul

Paul GONDCHARTON from Grenoble, FR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-10-18

US20180297143A1

Performing operations; transporting

Method for adhering a first structure and a second structure

#2 | 2018-08-02

US20180218999A1

Electricity

Direct bonding method

#3 | 2017-08-17

US20170236800A1

Electricity

Method for direct adhesion via low-roughness metal layers

#4 | 2017-07-27

US20170213807A1

Electricity

TUNGSTEN LAYER PASSIVATION PROCESS AND DIRECT BONDING PROCESS

#5 | 2017-01-26

US20170025377A1

Electricity

Process for producing a structure by assembling at least two elements by direct adhesive bonding

#6 | 2016-06-30

US20160189995A1

Electricity

Process for manufacturing a semiconductor structure with temporary bonding via metal layers

#7 | 2016-05-05

US20160126215A1

Electricity

Method for assembling two substrates of different natures via a ductile intermediate layer

#8 | 2015-12-31

US20150380383A1

Electricity

Method for carrying out a conductive direct metal bonding

#9 | 2015-12-17

US20150364442A1

Electricity

Method for obtaining a bonding surface for direct bonding

InventorID:

1395841 ⎘