Daisuke MASUKO

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2015-12-31

Top Assignees for applications by Daisuke MASUKO

The entities that hold a legal rights for patent applications filed by inventor MASUKO Daisuke:

Daisuke MASUKO from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Resin composition, adhesive tape, and method for producing adhesive tape

InventorID:

1399866 ⎘