Asami Doi

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2015-12-31

Recent patent applications by Doi Asami

Asami Doi from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-12-31

US20150376475A1

Chemistry; metallurgy

POLYMER COMPOSITION, ADHESIVE COMPOSITION, TEMPERATURE-RESPONSIVE SHEET PRODUCED USING SAID POLYMER COMPOSITION, AND COLD-RELEASE ADHESIVE SHEET PRODUCED USING SAID ADHESIVE COMPOSITION

InventorID:

1399876 ⎘