Pleasanton, California
United States
26
2014-03-18
The entities that hold a legal rights for patent applications filed by inventor Lenz Eric:
Eric Lenz from Pleasanton, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Apparatus and method for controlling etch uniformity
#2 | 2014-02-13Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer
#3 | 2013-06-18Reclaim chemistry
#4 | 2013-04-04Prevention of particle adders when contacting a liquid meniscus over a substrate
#5 | 2013-03-14Apparatus including gas distribution member supplying process gas and radio frequency (RF) power for plasma processing
#6 | 2012-10-18Apparatus and Method for Reducing Substrate Pattern Collapse During Drying Operations
#7 | 2012-09-27Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer
#8 | 2012-04-05Carrier for reducing entrance and/or exit marks left by a substrate-processing meniscus
#9 | 2011-08-18Carrier for reducing entrance and/or exit marks left by a substrate-processing meniscus
#10 | 2011-02-03Apparatus and Method for Controlling Plasma Potential
#11 | 2011-02-03Apparatus and method for controlling plasma potential
#12 | 2010-12-02Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer
#13 | 2010-06-17Apparatus including showerhead electrode and heater for plasma processing
#14 | 2009-07-09Electrostatic chuck assembly with dielectric material and/or cavity having varying thickness, profile and/or shape, method of use and apparatus incorporating same
#15 | 2009-07-02Electrically enhancing the confinement of plasma
#16 | 2008-04-03Carrier for reducing entrance and/or exit marks left by a substrate-processing meniscus
#17 | 2008-01-10Apparatus and Method for Controlling Plasma Potential
#18 | 2007-08-16Sealed elastomer bonded Si electrodes and the like for reduced particle contamination in dielectric etch
#19 | 2007-04-05Electrostatic chuck assembly with dielectric material and/or cavity having varying thickness, profile and/or shape, method of use and apparatus incorporating same
#20 | 2006-03-30RF ground switch for plasma processing system
#21 | 2006-02-16Deformation reduction at the main chamber
#22 | 2006-01-10Plasma processor in plasma confinement region within a vacuum chamber
#23 | 2005-11-03Apparatus including gas distribution member supplying process gas and radio frequency (RF) power for plasma processing
#24 | 2005-11-03Apparatus including showerhead electrode and heater for plasma processing
#25 | 2005-09-27Deformation reduction at the main chamber
#26 | 2005-02-24Multiple frequency plasma processor method and apparatus
140013 ⎘