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Inventor profile of:

ROBERT BAUER

City:

ISMANING

Country:

Germany

Published Applications:

7

Last publication date:

2015-12-31

Top Assignees for applications by ROBERT BAUER

The entities that hold a legal rights for patent applications filed by inventor BAUER ROBERT:

FREESCALE SEMICONDUCTOR, INC 7 Austin, TX United States

Recent patent applications by BAUER ROBERT

ROBERT BAUER from ISMANING, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-12-31

US20150380353A1

METHOD OF FABRICATING AN INTEGRATED CIRCUIT DEVICE, AND AN INTEGRATED CIRCUIT DEVICE THEREFROM

#2 | 2012-02-02

US20120026716A1

Package assembly and method of tuning a natural resonant frequency of a package

#3 | 2011-11-03

US20110266663A1

Lead frame based semiconductor package and a method of manufacturing the same

#4 | 2011-09-22

US20110227229A1

Semiconductor wafer processing

#5 | 2010-09-23

US20100237479A1

Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

#6 | 2009-09-03

US20090218663A1

Lead frame based semiconductor package and a method of manufacturing the same

#7 | 2007-10-11

US20070238205A1

Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

InventorID:

1403916 ⎘