Daisuke Kitahara

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2022-02-24

Top Assignees for applications by Daisuke Kitahara

The entities that hold a legal rights for patent applications filed by inventor Kitahara Daisuke:

Daisuke Kitahara from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

RESIN COMPOSITION AND METAL BASE COPPER-CLAD LAMINATE

APPARATUS, COMPOSITION FOR ADHESIVE, AND ADHESIVE SHEET

InventorID:

1408591 ⎘