Corvallis, Oregon
United States
180
2026-04-09
The entities that hold a legal rights for patent applications filed by inventor Cumbie Michael W.:
Michael W. Cumbie from Corvallis, US has applied for patents for these inventions. The list has both pending applications and granted patents:
PLASMA BONDING FORMATION OF DIRECT ELECTRICAL AND FLUIDIC INTERCONNECTS
#2 | 2025-09-25DIE FOR A PRINTHEAD
#3 | 2025-05-01MICROCHANNEL STRUCTURES WITH BRUIED STRUCTURES
#4 | 2025-04-03FLUID EJECTION DEVICE COMPONENTS
#5 | 2025-03-13FLUID EJECTION DEVICE ASSEMBLIES
#6 | 2024-07-11OVERFILL-TOLERANT MICROFLUIDIC STRUCTURES
#7 | 2024-04-11Integrated circuits including memory cells
#8 | 2024-04-11DIGITAL MICROFLUIDIC DEVICES WITH PARKING ELECTRODES
#9 | 2024-02-15FLUID DISPENSING DEVICES
#10 | 2023-12-07Molded structures with channels
#11 | 2023-11-09FLUID EJECTION DEVICE WITH BREAK(S) IN COVER LAYER
#12 | 2023-11-09Accessing registers of fluid ejection devices
#13 | 2023-11-09Integrated circuits including memory cells
#14 | 2023-09-28DIE FOR A PRINTHEAD
#15 | 2023-08-24MICROFLUIDIC PACKAGE
#16 | 2023-08-10Communicating print component
#17 | 2023-07-27Nozzle arrangements
#18 | 2023-06-08Microfluidic devices
#19 | 2023-05-18Processes for formation of molded panels by bringing release liner of mold chase in direct contact with protective layer
#20 | 2023-05-18MOLDED PANELS
#21 | 2023-05-11MOLDED MICROFLUIDIC SUBSTRATE HAVING MICROFLUIDIC CHANNEL
#22 | 2023-03-16Integrated circuit with address drivers for fluidic die
#23 | 2023-01-26CAPILLARY STRUCTURES
#24 | 2023-01-05CAPILLARY STRUCTURES
#25 | 2022-12-29ARRAY DROPLET MANIPULATIONS
#26 | 2022-11-03Logic circuitry
#27 | 2022-11-03Fluid ejection devices including contact pads
#28 | 2022-09-22MONOLITHIC CARRIER STRUCTURE INCLUDING FLUID ROUTING FOR DIGITAL DISPENSING
#29 | 2022-09-01Integrated circuits including customization bits
#30 | 2022-08-11DIGITAL MICROFLUIDICS DEVICE WITH DROPLET PROCESSING COMPONENTS
#31 | 2022-07-21Nozzle arrangements and supply channels
#32 | 2022-07-14PRINT COMPONENT WITH MEMORY ARRAY USING INTERMITTENT CLOCK SIGNAL
#33 | 2022-06-30Fluid circulation and ejection
#34 | 2022-06-09CIRCULATION PATH FOR BUBBLER
#35 | 2022-06-09FLUID PROPERTY SENSOR
#36 | 2022-05-12Coplanar modular printbars
#37 | 2022-04-28MOLDED STRUCTURES WITH CHANNELS
#38 | 2022-04-14Molded structures with channels
#39 | 2022-04-14FLUID PROPELLING APPARATUS INCLUDING A HEAT SINK
#40 | 2022-04-07PRINTHEADS
#41 | 2022-04-07Fluid ejection polymeric recirculation channel
#42 | 2022-03-10Fluid ejection device with break(s) in cover layer
#43 | 2022-02-03Curved fluid ejection devices
#44 | 2022-02-03Integrated circuits including memory cells
#45 | 2021-12-30SENSOR CIRCUITRY PACKAGE FOR REPLACEMENT PRINT APPARATUS COMPONENT
#46 | 2021-12-30Liquid sensor package
#47 | 2021-12-30Circuit die alignment target
#48 | 2021-12-02LOGIC CIRCUITRY PACKAGE
#49 | 2021-11-18Logic circuitry
#50 | 2021-10-21IMAGING MEDIUM
#51 | 2021-10-21Fluidic die assemblies with rigid bent substrates
#52 | 2021-10-14CURVED FLUID EJECTION MODULES
#53 | 2021-09-30Microfluidic devices
#54 | 2021-09-23Fluidic ejection dies with enclosed cross-channels
#55 | 2021-09-23Nozzle arrangements
#56 | 2021-09-16IMAGING MEDIA
#57 | 2021-09-16Thermal contact dies
#58 | 2021-09-16Ink container
#59 | 2021-09-16Fluid ejection dies
#60 | 2021-09-09Horizontal interface for fluid supply cartridge having digital fluid level sensor
#61 | 2021-08-26Fluid ejection devices including electrical interconnect elements for fluid ejection dies
#62 | 2021-08-19FLUID PROPERTY SENSOR
#63 | 2021-08-12DUAL DIRECTION DISPENSERS
#64 | 2021-08-05Replaceable print apparatus component
#65 | 2021-07-29Integrated circuits including customization bits
#66 | 2021-07-29Accessing registers of fluid ejection devices
#67 | 2021-07-22Fluid ejection devices including contact pads
#68 | 2021-07-22Print component with memory array using intermittent clock signal
#69 | 2021-07-22Logic circuitry package
#70 | 2021-07-15Multiple circuits coupled to an interface
#71 | 2021-07-15Integrated circuits including memory cells
#72 | 2021-07-01MICROFLUIDIC DEVICE CHANNEL LAYER
#73 | 2021-06-24FLUID EJECTION ASSEMBLIES
#74 | 2021-06-10Embedded microfluidic devices
#75 | 2021-06-10FLUID TESTING
#76 | 2021-05-13FLUID DISPENSER
#77 | 2021-05-06Fluid property sensor
#78 | 2021-05-06FLUID PROPERTY SENSOR
#79 | 2021-05-06SLIDABLE SERVICE ASSEMBLIES
#80 | 2021-05-06Fluidic ejection dies with enclosed cross-channels
#81 | 2021-03-18Logic circuitry for sensor data communications
#82 | 2021-03-04Temperature-cycling microfluidic devices
#83 | 2021-02-25Logic circuitry
#84 | 2021-02-18LOGIC CIRCUITRY
#85 | 2021-02-11IMAGING MEDIUM
#86 | 2021-02-11IMAGING MEDIUM
#87 | 2021-02-11Print head interposers
#88 | 2021-01-28IMAGING MEDIUM
#89 | 2020-12-29Logic circuitry
#90 | 2020-12-24LOGIC CIRCUITRY
#91 | 2020-12-24Nozzle arrangements and feed holes
#92 | 2020-12-24Nozzle arrangements and supply channels
#93 | 2020-12-24Nozzle arrangements
#94 | 2020-12-03Logic circuitry
#95 | 2020-11-26Molded printhead
#96 | 2020-11-26Fluid thermal processing
#97 | 2020-09-17Fluid circulation and ejection
#98 | 2020-09-10Cross-die recirculation channels and chamber recirculation channels
#99 | 2020-09-10Planarization layers over silicon dies
#100 | 2020-08-06Fluid ejection die molded into molded body
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