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Inventor profile of:

Eiji IWAMURA

City:

Osaka

Country:

Japan

Published Applications:

1

Last publication date:

2016-01-28

Recent patent applications by IWAMURA Eiji

Eiji IWAMURA from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2016-01-28

US20160024366A1

Chemistry; metallurgy

HEAT-DISSAPATING POWDER COATING COMPOSITION, HEAT-DISSIPATING COATING FILM, AND COATED ARTICLE

InventorID:

1423406 ⎘