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Inventor profile of:

Bodo Forg

City:

Mainz

Country:

Germany

Published Applications:

8

Last publication date:

2022-09-08

Top Assignees for applications by Bodo Forg

The entities that hold a legal rights for patent applications filed by inventor Forg Bodo:

  • HEIMANN SENSOR GMBH 8 Dresden, Germany

Recent patent applications by Forg Bodo

Bodo Forg from Mainz, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-09-08
US20220283034A1
Physics

Method for producing a thermal infrared sensor array in a vacuum-filled wafer-level housing

#2 | 2020-10-22
US20200333190A1
Physics

High-resolution thermopile infrared sensor array

#3 | 2020-04-23
US20200124481A1
Physics

High resolution thermopile infrared sensor array having monolithically integrated signal processing

#4 | 2020-01-30
US20200033195A1
Physics

High-resolution thermopile infrared sensor array

#5 | 2018-11-22
US20180335347A1
Physics

Thermal infrared sensor array in wafer-level package

#6 | 2018-10-04
US20180283958A1
Physics

High resolution thermopile infrared sensor array having monolithically integrated signal processing

#7 | 2016-01-28
US20160025571A1
Physics

Thermopile infrared sensor structure with a high filling level

#8 | 2011-07-21
US20110174978A1
Physics

Thermopile infrared sensor by monolithic silicon micromachining

InventorID:

1424698 ⎘

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