Ming-Che Wu

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2017-05-25

Top Assignees for applications by Ming-Che Wu

The entities that hold a legal rights for patent applications filed by inventor Wu Ming-Che:

Ming-Che Wu from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of wafer level packaging of a module

Semiconductor package with conformal EM shielding structure and manufacturing method of same

Multi-dimensional antenna in RFID system for reading tags and orientating multi-dimensional objects

InventorID:

1434779 ⎘