Hubei
China
44
2023-03-23
The entities that hold a legal rights for patent applications filed by inventor Chen Jun:
Jun Chen from Hubei, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
Hybrid bonding contact structure of three-dimensional memory device
#2 | 2023-03-16Staircase structure for memory device
#3 | 2023-03-16Staircase structure for memory device
#4 | 2022-10-06Three-panel OLED display stack having non-overlapping pixels
#5 | 2022-07-28Method for forming channel hole plug of three-dimensional memory device
#6 | 2022-06-30Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
#7 | 2021-12-23Intelligent electronic lock
#8 | 2021-09-23Three-dimensional memory devices having a plurality of NAND strings located between a substrate and a single crystalline silicon layer
#9 | 2021-05-06Hybrid bonding contact structure of three-dimensional memory device
#10 | 2021-05-06Embedded pad structures of three-dimensional memory devices and fabrication methods thereof
#11 | 2021-04-22Memory device and forming method thereof
#12 | 2021-04-08Memory device and forming method thereof
#13 | 2021-04-01Three-dimensional memory devices and methods for forming the same
#14 | 2021-04-01Memory device and forming method thereof
#15 | 2021-01-07Source structure of three-dimensional memory device and method for forming the same
#16 | 2020-12-03Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
#17 | 2020-09-17Hybrid bonding contact structure of three-dimensional memory device
#18 | 2020-09-17Staircase structure for memory device
#19 | 2020-08-20Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
#20 | 2020-05-14Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
#21 | 2020-02-20Embedded pad structures of three-dimensional memory devices and fabrication methods thereof
#22 | 2019-12-12Method for forming dual-deck channel hole structure of three-dimensional memory device
#23 | 2019-10-31Built-in motor for bicycle and electric powered bicycle
#24 | 2019-10-24Method for forming channel hole plug of three-dimensional memory device
#25 | 2019-10-24Memory device and forming method thereof
#26 | 2019-08-08Three-dimensional memory devices having a plurality of NAND strings
#27 | 2019-08-08Three-dimensional memory devices having a plurality of NAND strings
#28 | 2019-05-30Source structure of three-dimensional memory device and method for forming the same
#29 | 2019-05-09Three-dimensional memory devices and fabricating methods thereof
#30 | 2019-05-02Middle frame and flexible display device
#31 | 2019-03-28Memory cell structure of a three-dimensional memory device
#32 | 2019-03-28Word line contact structure for three-dimensional memory devices and fabrication methods thereof
#33 | 2019-03-21Three-dimensional memory devices having a plurality of NAND strings
#34 | 2019-03-14Staircase structure for memory device
#35 | 2019-03-14Three-dimensional memory devices and methods for forming the same
#36 | 2019-03-07Three-dimensional memory devices and fabricating methods thereof
#37 | 2019-02-28Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
#38 | 2019-02-28Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
#39 | 2019-02-28Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
#40 | 2019-02-21Hybrid bonding contact structure of three-dimensional memory device
#41 | 2018-12-04Source structure of three-dimensional memory device and method for forming the same
#42 | 2016-04-28Non-stick cooking container
#43 | 2016-02-11Semiconductor cooling method and method of heat dissipation
#44 | 2015-12-24Testing device for propagation characteristic of electromagnetic wave in gas insulated switchgear and testing method therefor
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