David J. Meyer

City:

Chicago, Illinois

Country:

United States

Published Applications:

Last publication date:

2023-07-13

Top Assignees for applications by David J. Meyer

The entities that hold a legal rights for patent applications filed by inventor Meyer David J.:

David J. Meyer from Chicago, US has applied for patents for these inventions. The list has both pending applications and granted patents:

SOLDER PADS WITH CONCAVE EDGES FOR BALL GRID ARRAYS

Bipolar projected haptics with balanced loading

Multi rate processing device for rendering haptic feedback

Bipolar projected haptics with balanced loading

Multi rate processing device for rendering haptic feedback

Multi rate processing device for rendering haptic feedback

Interfaces and methods of digital composition and editing of textures for rendering on tactile surfaces

Multi-Layer Transparent Force Sensor

InventorID:

1461205 ⎘