Bo Bai

City:

Dresden

Country:

Germany

Published Applications:

Last publication date:

2021-08-26

Top Assignees for applications by Bo Bai

The entities that hold a legal rights for patent applications filed by inventor Bai Bo:

Bo Bai from Dresden, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Chip corner areas with a dummy fill pattern

FinFET device with enlarged channel regions

FinFET device with enlarged channel regions

INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS

InventorID:

1463022 ⎘