Wappingers Falls, New York
United States
88
2020-10-06
The entities that hold a legal rights for patent applications filed by inventor Long David C.:
David C. Long from Wappingers Falls, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Tamper detection at enclosure-to-board interface
#2 | 2020-06-113-D flex circuit forming
#3 | 2020-05-14Pressure-induced battery pack venting with filtering
#4 | 2020-03-17Tamper detection at enclosure-to-board interface
#5 | 2020-03-173-D flex circuit forming
#6 | 2020-02-06Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout
#7 | 2020-01-02Enclosure-to-board interface with tamper-detect circuit(s)
#8 | 2019-12-19Enclosure with tamper respondent sensor
#9 | 2019-12-19Apparatus for facilitating evaluating rechargeable batteries
#10 | 2019-10-10Tamper-respondent sensors with liquid crystal polymer layers
#11 | 2019-08-22Enclosure-to-board interface with tamper-detect circuit(s)
#12 | 2019-07-18Overlapping, discrete tamper-respondent sensors
#13 | 2019-05-28Enclosure-to-board interface with tamper-detect circuit(s)
#14 | 2019-02-14Circuit boards and electronic packages with embedded tamper-respondent sensor
#15 | 2019-01-31Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout
#16 | 2019-01-31Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout
#17 | 2019-01-17Circuit boards and electronic packages with embedded tamper-respondent sensor
#18 | 2018-08-16Tamper-respondent assembly with flexible tamper-detect sensor(s) overlying in-situ-formed tamper-detect sensor
#19 | 2018-05-03Tamper-respondent assemblies with trace regions of increased susceptibility to breaking
#20 | 2018-04-19Enclosure with inner tamper-respondent sensor(s) and physical security element(s)
#21 | 2018-04-19Tamper-respondent assembly with vent structure
#22 | 2018-04-12Tamper-respondent assemblies with bond protection
#23 | 2018-04-12Tamper-respondent assemblies with bond protection
#24 | 2018-04-05Tamper-proof electronic packages formed with stressed glass
#25 | 2018-04-05Tamper-respondent assemblies with enclosure-to-board protection
#26 | 2018-04-05Overlapping, discrete tamper-respondent sensors
#27 | 2018-03-08Tamper-respondent assemblies
#28 | 2017-11-16Tamper-proof electronic packages formed with stressed glass
#29 | 2017-06-22Tamper-respondent assemblies with enclosure-to-board protection
#30 | 2017-06-15Applying pressure to adhesive using CTE mismatch between components
#31 | 2017-06-01Tamper-respondent assembly with vent structure
#32 | 2017-05-23Tamper-respondent assemblies with enclosure-to-board protection
#33 | 2017-05-11Enclosure with inner tamper-respondent sensor(s)
#34 | 2017-03-30Enclosure with inner tamper-respondent sensor(s) and physical security element(s)
#35 | 2017-03-30Tamper-respondent assemblies with bond protection
#36 | 2017-03-30Enclosure with inner tamper-respondent sensor(s)
#37 | 2017-03-30Circuit boards and electronic packages with embedded tamper-respondent sensor
#38 | 2017-03-30Tamper-respondent assemblies
#39 | 2017-03-30Method of fabricating a tamper-respondent assembly with region(s) of increased susceptibility to damage
#40 | 2017-03-30Method of fabricating a tamper-respondent sensor assembly
#41 | 2017-03-30Method of fabricating tamper-respondent sensor
#42 | 2017-03-30Tamper-respondent assemblies
#43 | 2017-03-30Tamper-respondent assemblies with region(s) of increased susceptibility to damage
#44 | 2017-03-30Tamper-respondent assemblies with bond protection
#45 | 2017-03-30Overlapping, discrete tamper-respondent sensors
#46 | 2017-03-30Tamper-respondent sensors with formed flexible layer(s)
#47 | 2017-03-30Circuit boards and electronic packages with embedded tamper-respondent sensor
#48 | 2017-01-31Applying pressure to adhesive using CTE mismatch between components
#49 | 2017-01-24Tamper-respondent assemblies with enclosure-to-board protection
#50 | 2016-10-13Liquid cooled compliant heat sink and related method
#51 | 2016-03-03Liquid cooled compliant heat sink and related method
#52 | 2010-08-12LIQUID COOLED COMPLIANT HEAT SINK AND RELATED METHOD
#53 | 2009-07-09Feedback loop system for passenger safety
#54 | 2009-06-11Structure for implementing secure multichip modules for encryption applications
#55 | 2009-04-09Apparatus for controlling alignment between precision ground plates and method of controlling a desired alignment between opposing precision ground plates
#56 | 2009-04-07Method of correcting distortions in digital images captured by a digital camera system
#57 | 2008-12-25Method and structure for a pull test for controlled collapse chip connections and ball limiting metallurgy
#58 | 2008-12-18Method and structure to improve thermal dissipation from semiconductor devices
#59 | 2008-09-25CIRCUIT BOARD CAM-ACTION STANDOFF CONNECTOR
#60 | 2008-09-18Thermal pillow
#61 | 2008-09-11Method and structure to improve thermal dissipation from semiconductor devices
#62 | 2008-06-24Digital camera including a distortion correction system
#63 | 2008-04-17Virtual window with simulated parallax and field of view change
#64 | 2008-03-27IC chip package having automated tolerance compensation
#65 | 2008-03-06Fully automated paste dispense system for dispensing small dots and lines
#66 | 2008-03-06Fully automated paste dispense system for dispensing small dots and lines
#67 | 2008-03-06Fully automated paste dispense system for dispensing small dots and lines
#68 | 2008-01-03Method and structure for implementing secure multichip modules for encryption applications
#69 | 2007-10-04Common carrier
#70 | 2007-09-27Common carrier
#71 | 2007-03-08SOCKET MEASUREMENT APPARATUS AND METHOD
#72 | 2007-03-08Elastomer interposer with voids in a compressive loading system
#73 | 2006-10-19Method and structure for implementing secure multichip modules for encryption applications
#74 | 2006-10-10Apparatus for implementing a self-centering land grid array socket
#75 | 2006-05-04Expandable standoff connector with slit collar and related method
#76 | 2006-05-04Circuit board cam-action standoff connector
#77 | 2006-03-16Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip
#78 | 2006-01-24Method of assembling an interconnect device assembly
#79 | 2005-12-29Common carrier
#80 | 2005-08-11Electronic package repair process
#81 | 2005-07-14Real time usage monitor and method for detecting entrapped air
#82 | 2005-07-12Electronic package repair process
#83 | 2005-04-14Method and apparatus for rapid cooling of metal screening masks
#84 | 2005-03-17ROLLING CONTACT SCREENING METHOD AND APPARATUS
#85 | 2005-03-03External verification of package processed linewidths and spacings in semiconductor packages
#86 | 2005-02-24Fully automated paste dispense process for dispensing small dots and lines
#87 | 2005-01-27Thermal enhanced extended surface tape for integrated circuit heat dissipation
#88 | 2005-01-13Dual-layer compliant polymeric nozzle
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