Michael SCHÄFER

METAL SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING OF COMPONENTS

METAL SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING OF COMPONENTS

METAL SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING OF COMPONENTS

Method for producing a sandwhich arrangement

Sinter paste with coated silver oxide on noble and non-noble surfaces that are difficult to sinter

Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component

METAL SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING OF COMPONENTS

METHOD FOR CONNECTING COMPONENTS BY PRESSURE SINTERING

Method for producing a silver sintering agent having silver oxide surfaces and use of said agent in methods for joining components by pressure sintering

METHOD FOR APPLYING DRIED METAL SINTERING COMPOUND BY MEANS OF A TRANSFER SUBSTRATE ONTO A CARRIER FOR ELECTRONIC COMPONENTS, CORRESPONDING CARRIER, AND THE USE THEREOF FOR SINTERED CONNECTION TO ELECTRONIC COMPONENTS

METAL PREPARATION FOR CONNECTING COMPONENTS

Carrier and clip each having sinterable, solidified paste for connection to a semiconductor element, corresponding sintering paste, and corresponding production method and use

Electro-conductive Paste with Silver Oxide and Organic Additive

SINTER PASTE WITH PARTIALLY OXIDIZED METAL PARTICLES

SINTER PASTE WITH COATED SILVER OXIDE ON NOBLE AND NON-NOBLE SURFACES THAT ARE DIFFICULT TO SINTER

METHOD OF JOINING COMPONENTS USING METAL PASTE WITH OXIDIZING AGENTS

PASTE AND METHOD FOR CONNECTING ELECTRONIC COMPONENT TO SUBSTRATE

Contacting means and method for contacting electrical components

Use of Aliphatic Hydrocarbons and Paraffins as Solvents for Silver Sinter Pastes