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Inventor profile of:

Eric Desbonnets

City:

Lumbin

Country:

France

Published Applications:

22

Last publication date:

2026-01-22

Top Assignees for applications by Eric Desbonnets

The entities that hold a legal rights for patent applications filed by inventor Desbonnets Eric:

Recent patent applications by Desbonnets Eric

Eric Desbonnets from Lumbin, FR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-01-22
US20260026321A1
Electricity

SEMICONDUCTOR STRUCTURE FOR DIGITAL AND RADIOFREQUENCY APPLICATIONS, AND METHOD FOR MANUFACTURING SUCH A STRUCTURE

 #2 | 2024-11-28
US20240397825A1
Electricity

HYBRID STRUCTURE FOR A SURFACE ACOUSTIC WAVE DEVICE

 #3 | 2023-11-23
US20230378931A1
Electricity

Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device

 #4 | 2022-11-17
US20220368036A1
Electricity

STRUCTURE FOR RADIO FREQUENCY APPLICATIONS

 #5 | 2022-09-01
US20220277988A1
Electricity

Structures for radiofrequency applications and related methods

 #6 | 2022-05-19
US20220158080A1
Electricity

Hybrid structure for a surface acoustic wave device

 #7 | 2022-03-10
US20220076993A1
Electricity

SEMICONDUCTOR STRUCTURE FOR DIGITAL AND RADIOFREQUENCY APPLICATIONS, AND METHOD FOR MANUFACTURING SUCH A STRUCTURE

 #8 | 2022-03-10
US20220076992A1
Electricity

SEMICONDUCTOR STRUCTURE FOR DIGITAL AND RADIOFREQUENCY APPLICATIONS

 #9 | 2021-09-09
US20210280990A1
Electricity

Structure for radio frequency applications

 #10 | 2021-05-13
US20210143053A1
Electricity

Structures for radiofrequency applications and related methods

 #11 | 2021-04-29
US20210121103A1
Human necessities

Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device

 #12 | 2020-07-16
US20200228088A1
Electricity

Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device

 #13 | 2020-05-28
US20200169222A1
Electricity

Method for minimizing distortion of a signal in a radiofrequency circuit

 #14 | 2019-12-05
US20190372243A1
Electricity

Structure for radio frequency applications

 #15 | 2019-05-23
US20190157137A1
Electricity

Structure for radiofrequency applications

 #16 | 2019-01-31
US20190036007A1
Electricity

Hybrid structure for a surface acoustic wave device

 #17 | 2019-01-03
US20190007024A1
Electricity

Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device

 #18 | 2018-11-01
US20180316329A1
Electricity

COMPOSITE STRUCTURE AND ASSOCIATED PRODUCTION METHOD

 #19 | 2018-01-25
US20180024186A1
Physics

Method, device and system for measuring an electrical characteristic of a substrate

 #20 | 2017-08-03
US20170221839A1
Electricity

Structure for radio-frequency applications

 #21 | 2017-07-20
US20170207164A1
Electricity

Method for fabricating semiconductor structures including a high resistivity layer, and related semiconductor structures

 #22 | 2016-03-03
US20160065162A1
Electricity

Advanced thermally compensated surface acoustic wave device and fabrication
InventorID:

1463774 ⎘