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Inventor profile of:

Ryan John Lewis

City:

Boulder, Colorado

Country:

United States

Published Applications:

Last publication date:

2025-12-18

Top Assignees for applications by Ryan John Lewis

The entities that hold a legal rights for patent applications filed by inventor Lewis Ryan John:

Kelvin Thermal Technologies, Inc. 7 Boulder, CO United States
The Regents of the University of Colorado, a body corporate 2 Denver, CO United States
The Regents of the University of Colorado 1 Denver, CO United States

Recent patent applications by Lewis Ryan John

Ryan John Lewis from Boulder, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-12-18

US20250386457A1

Electricity

VAPOR CHAMBER

#2 | 2023-10-19

US20230332841A1

Mechanical engineering

MICROPILLAR-ENABLED THERMAL GROUND PLANE

#3 | 2022-05-19

US20220155025A1

Mechanical engineering

POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE

#4 | 2020-09-24

US20200300563A1

Mechanical engineering

Micropillar-enabled thermal ground plane

#5 | 2020-06-11

US20200182557A1

Mechanical engineering

VAPOR CHAMBER

#6 | 2019-12-26

US20190390919A1

Mechanical engineering

POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE

#7 | 2018-05-10

US20180128553A1

Mechanical engineering

Method and device for spreading high heat fluxes in thermal ground planes

#8 | 2018-04-19

US20180106554A1

Mechanical engineering

Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems

#9 | 2016-06-09

US20160161193A1

Mechanical engineering

Polymer-based microfabricated thermal ground plane

#10 | 2016-03-17

US20160081227A1

Electricity

VACUUM-ENHANCED HEAT SPREADER

#11 | 2016-03-17

US20160076820A1

Mechanical engineering

Micropillar-enabled thermal ground plane

InventorID:

1475153 ⎘