DONALD E. COOPER

City:

Moorpark, California

Country:

United States

Published Applications:

Last publication date:

2017-03-02

Top Assignees for applications by DONALD E. COOPER

The entities that hold a legal rights for patent applications filed by inventor COOPER DONALD E.:

DONALD E. COOPER from Moorpark, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Tiled hybrid array and method of forming

Hybrid assembly with improved thermal performance

Thermal-contraction matched hybrid device package

SELF-ALIGNING HYBRIDIZATION METHOD

Self-aligning hybridization method

Hybrid circuit structure and partial backfill method for improving thermal cycling reliability of same

InventorID:

147864 ⎘