Tokyo
Japan
13
2024-08-29
The entities that hold a legal rights for patent applications filed by inventor Ishida Yuichi:
Yuichi Ishida from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
PIEZOELECTRIC COIL WITH A SENSOR AND ELECTRONIC APPARATUS
#2 | 2024-06-13GAS DETECTION METHOD, INFORMATION PROCESSING APPARATUS, METHOD OF DIAGNOSING A PLANT, AND PLANT DIAGNOSING APPARATUS
#3 | 2023-07-13PIEZOELECTRIC COIL AND ELECTRONIC APPARATUS
#4 | 2023-06-22Polyamic acid having specific composition, varnish, cured product, and composite material
#5 | 2023-02-09POLYAMIC ACID HAVING SPECIFIC COMPOSITION, VARNISH, CURED PRODUCT, AND COMPOSITE MATERIAL
#6 | 2022-12-29Gas detection method and information processing apparatus
#7 | 2021-11-04IMIDE OLIGOMER, VARNISH, CURED PRODUCTS THEREOF, AND PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL USING THESE
#8 | 2019-03-07Terminally modified imide oligomer, varnish, cured products thereof, film, and imide prepreg and fiber-reinforced composite material using these
#9 | 2018-09-27Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4′-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereof
#10 | 2017-06-01Varnish including 2-phenyl-4,4′-diaminodiphenyl ether, imide resin composition having excellent moldability, cured resin molded article having excellent breaking elongation, prepreg thereof, imide prepreg thereof, and fiber-reinforced material thereof having high heat resistance and excellent mechanical strength
#11 | 2016-03-24Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4′-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereof
#12 | 2011-07-07Soluble terminally modified imide oligomer using 2-phenyl-4, 4′-diaminodiphenyl ether, varnish, cured product thereof, imide prepreg thereof, and fiber-reinforced laminate having excellent heat resistance
#13 | 2006-05-23Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same
1481439 ⎘