Hongwei DU

City:

Country:

China

Published Applications:

Last publication date:

2016-03-24

Top Assignees for applications by Hongwei DU

The entities that hold a legal rights for patent applications filed by inventor DU Hongwei:

Hongwei DU from , CN has applied for patents for these inventions. The list has both pending applications and granted patents:

Shutter covered on sound hole of loudspeaker module and assembling method thereof, loudspeaker module

InventorID:

1485692 ⎘