Poughkeepsie, New York
United States
35
2019-11-07
The entities that hold a legal rights for patent applications filed by inventor Feger Claudius:
Claudius Feger from Poughkeepsie, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Nanoparticle design for enhanced oil recovery
#2 | 2017-06-22Nanoparticle design for enhanced oil recovery
#3 | 2017-01-12Microchannel, microfluidic chip and method for processing microparticles in a fluid flow
#4 | 2017-01-12Trapping at least one microparticle
#5 | 2016-05-19Method and integrated device for analyzing liquid flow and liquid-solid interface interaction
#6 | 2016-03-31Method and integrated device for analyzing liquid flow and liquid-solid interface interaction
#7 | 2014-09-18Forming constant diameter spherical metal balls
#8 | 2013-04-02Forming constant diameter spherical metal balls
#9 | 2012-12-06Injection molded solder process for forming solder bumps on substrates
#10 | 2012-12-06Injection molded solder process for forming solder bumps on substrates
#11 | 2012-05-10Multilayer securing structure and method thereof for the protection of cryptographic keys and code
#12 | 2010-07-01CHIP CARRIER BEARING LARGE SILICON FOR HIGH PERFORMANCE COMPUTING AND RELATED METHOD
#13 | 2010-01-07Chip-level underfill method of manufacture
#14 | 2009-10-08Method and system for collecting alignment data from coated chips or wafers
#15 | 2009-07-16Assembly Method For Reworkable Chip Stacking With Conductive Film
#16 | 2009-04-30WAFER-LEVEL UNDERFILL PROCESS USING OVER-BUMP-APPLIED RESIN
#17 | 2009-04-23Alignment Marks on the Edge of Wafers and Methods for Same
#18 | 2009-04-14Method and apparatus for thermally induced testing of materials under transient temperature
#19 | 2009-03-26APPARATUS AND METHODS FOR REMAKEABLE CONNECTIONS TO OPTICAL WAVEGUIDES
#20 | 2009-02-05Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation
#21 | 2008-11-20Vacuum extrusion method of manufacturing a thermal paste
#22 | 2008-10-30Marks for the Alignment of Wafer-Level Underfilled Silicon Chips and Method to Produce Same
#23 | 2008-09-25Physically highly secure multi-chip assembly
#24 | 2008-09-11Reversible thermal thickening grease
#25 | 2007-10-04Heat transfer control structures using thermal phonon spectral overlap
#26 | 2007-06-21Physically highly secure multi-chip assembly
#27 | 2007-02-01Apparatus and methods for remakeable connections to optical waveguides
#28 | 2007-01-04Electrical connecting device and method of forming same
#29 | 2006-10-03Apparatus and methods for remakeable connections to optical waveguides
#30 | 2006-08-10Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation
#31 | 2006-06-08Solder interconnect structure and method using injection molded solder
#32 | 2005-11-10Underfilling with acid-cleavable acetal and ketal epoxy oligomers
#33 | 2005-08-16Tamper-responding encapsulated enclosure having flexible protective mesh structure
#34 | 2005-08-02Bilayer wafer-level underfill
#35 | 2005-07-19Acid-cleavable acetal and ketal based epoxy oligomers
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