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Inventor profile of:

Dan Treuz

City:

Chicago, Illinois

Country:

United States

Published Applications:

1

Last publication date:

2016-04-07

Recent patent applications by Treuz Dan

Dan Treuz from Chicago, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2016-04-07

US20160098670A1

Technological and Financial Partnerships to Enable a Package Exchange Service

InventorID:

1495568 ⎘