Ryosuke Kamimura

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2016-05-05

Top Assignees for applications by Ryosuke Kamimura

The entities that hold a legal rights for patent applications filed by inventor Kamimura Ryosuke:

Ryosuke Kamimura from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Antiadhesive Kit and Method of Adhesion Prevention

Antiadhesive Kit, Process for Producing the Same and Method of Adhesion Prevention

Collagen substrate, method of manufacturing the same, and method of using the same

Biodegradable substrate, prosthetic material for tissue regeneration, and cultured tissue

Method of sterilizing a biocompatible material

InventorID:

1516593 ⎘