Keiichi HASEBE

City:

Country:

United States

Published Applications:

Last publication date:

2016-05-05

Top Assignees for applications by Keiichi HASEBE

The entities that hold a legal rights for patent applications filed by inventor HASEBE Keiichi:

Keiichi HASEBE from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same

InventorID:

1521896 ⎘