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Inventor profile of:

Jun DOU

City:

Tokyo

Country:

Japan

Published Applications:

7

Last publication date:

2023-11-30

Top Assignees for applications by Jun DOU

The entities that hold a legal rights for patent applications filed by inventor DOU Jun:

  • SHOWA DENKO K.K. 3 Tokyo, Japan
  • RESONAC CORPORATION 3 Tokyo, Japan
  • SHOWA DENKO K. K. 2 Tokyo, Japan
  • SHOWA DENKO K.K. 1 Minato-ku, Tokyo, Japan

Recent patent applications by DOU Jun

Jun DOU from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-11-30
US20230382741A1
Chemistry; metallurgy

METHOD FOR REMOVING OXYGEN MOLECULE AND METHOD FOR PURIFYING CARBON MONOXIDE

#2 | 2023-11-02
US20230348346A1
Chemistry; metallurgy

OCTAFLUOROCYCLOBUTANE PURIFICATION METHOD

#3 | 2021-07-29
US20210230010A1
Chemistry; metallurgy

Method of producing boron trichloride

#4 | 2021-07-22
US20210221938A1
Chemistry; metallurgy

Method for producing polyurethane, epoxy carboxylate composition, polyurethane, and polyurethane resin composition

#5 | 2019-05-23
US20190153149A1
Chemistry; metallurgy

Epoxy (meth) acrylate compound and curable composition containing same

#6 | 2016-09-01
US20160251531A1
Chemistry; metallurgy

Conductive composition for thin film printing and method for forming thin film conductive pattern

#7 | 2016-05-12
US20160133350A1
Electricity

CONDUCTIVE RESIN COMPOSITION FOR MICROWAVE HEATING

InventorID:

1528895 ⎘

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