Osaka
Japan
5
2014-06-12
The entities that hold a legal rights for patent applications filed by inventor Harima Jun:
Jun Harima from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
PACKAGING STRUCTURE FOR PATCHES
#2 | 2013-01-03ADHESIVE PATCH CONTAINING BISOPROLOL
#3 | 2010-03-04Adhesive patch
#4 | 2010-03-04Adhesive patch
#5 | 2009-10-01PATCH AND PATCH PREPARATION
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