Dresden
Germany
24
2024-08-29
The entities that hold a legal rights for patent applications filed by inventor Fischer Daniel:
Daniel Fischer from Dresden, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD FOR IMAGING WITH A SCANNING ELECTRON MICROSCOPE AND SCANNING ELECTRON MICROSCOPE FOR CARRYING OUT THE METHOD
#2 | 2024-02-01Charged particle beam system, method of operating a charged particle beam system, method of recording a plurality of images and computer programs for executing the methods
#3 | 2023-06-08Charged particle beam system, method of operating a charged particle beam system, method of recording a plurality of images and computer programs for executing the methods
#4 | 2020-07-23Method of operating a particle beam system, particle beam system and computer program product
#5 | 2018-08-02Insitu tool health and recipe quality monitoring on a CDSEM
#6 | 2017-11-16Method for in-die overlay control using FEOL dummy fill layer
#7 | 2015-08-27Inline residual layer detection and characterization post via post etch using CD-SEM
#8 | 2015-04-30Detection of particle contamination on wafers
#9 | 2014-07-10Method of depositing protective structures
#10 | 2013-03-21Repair of damaged surface areas of sensitive low-K dielectrics of microstructure devices after plasma processing by in situ treatment
#11 | 2012-09-06System for monitoring the condition of rotor blades at wind turbines
#12 | 2012-07-26Method of Depositing Protective Structures
#13 | 2012-03-01Re-establishing surface characteristics of sensitive low-k dielectrics in microstructure device by using an in situ surface modification
#14 | 2012-01-05Method of reducing erosion of a metal cap layer during via patterning in semiconductor devices
#15 | 2010-12-02Establishing a hydrophobic surface of sensitive low-k dielectrics of microstructure devices by in situ plasma treatment
#16 | 2010-12-02RE-ESTABLISHING A HYDROPHOBIC SURFACE OF SENSITIVE LOW-K DIELECTRICS IN MICROSTRUCTURE DEVICES
#17 | 2010-11-04Method of depositing protective structures
#18 | 2010-09-30MATERIAL STRIPPING IN SEMICONDUCTOR DEVICES BY EVAPORATION
#19 | 2010-04-01Method for passivating exposed copper surfaces in a metallization layer of a semiconductor device
#20 | 2009-12-24Method and system for quantitative inline material characterization in semiconductor production processes based on structural measurements and related models
#21 | 2009-11-05Method of reducing erosion of a metal cap layer during via patterning in semiconductor devices
#22 | 2008-08-28High yield plasma etch process for interlayer dielectrics
#23 | 2006-10-05Silicon substrate comprising positive etching profiles with a defined slope angle, and production method
#24 | 2006-05-11Method for structuring of silicon substrates for microsystem technological device elements and associated silicon substrate
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