Eiichi OHNO

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2021-07-22

Top Assignees for applications by Eiichi OHNO

The entities that hold a legal rights for patent applications filed by inventor OHNO Eiichi:

Eiichi OHNO from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern

Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern

COPPER AND/OR COPPER OXIDE DISPERSION, AND ELECTROCONDUCTIVE FILM FORMED USING DISPERSION

Dispersion

Copper and/or copper oxide dispersion, and electroconductive film formed using dispersion

InventorID:

1549741 ⎘