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Inventor profile of:

Neil Puhse

City:

Springfield, Illinois

Country:

United States

Published Applications:

1

Last publication date:

2013-03-21

Recent patent applications by Puhse Neil

Neil Puhse from Springfield, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-03-21

US20130073018A1

Human necessities

Thermal exchange composition-containing packs with color signaling covers

InventorID:

155575 ⎘