Shanghai
China
14
2025-07-17
The entities that hold a legal rights for patent applications filed by inventor WANG Su:
Su WANG from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
PROCESSING METHOD OF REMOTE ATTESTATION REPORT, DATABASE SERVICE END AND DATABASE CLIENT END
#2 | 2025-06-26DATA PROCESSING METHOD, APPARATUS, DEVICE AND STORAGE MEDIUM
#3 | 2025-06-12VIRTUALIZATION-BASED TRUSTED COMPUTING MEASUREMENT METHOD AND APPARATUS, DEVICE, AND STORAGE MEDIUM
#4 | 2025-01-16BOTTOM ANTI-REFLECTIVE COATING FOR DEEP ULTRAVIOLET LITHOGRAPHY, PREPARATION METHOD THEREFOR AND USE THEREOF
#5 | 2025-01-09ADDITIVE FOR 193 NM DRY PHOTORESIST AND PREPARATION METHOD FOR AND APPLICATION OF ADDITIVE
#6 | 2024-10-24POLYONIUM SALT PHOTOACID GENERATOR FOR ARF LIGHT SOURCE DRY LITHOGRAPHY, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF
#7 | 2024-09-12RESIN, AND ARF DRY PHOTORESIST COMPOSITION COMPRISING SAME AND APPLICATION
#8 | 2024-07-25RESIN AND 193 NM DRY PHOTORESIST CONTAINING SAME, AND PREPARATION METHOD THEREFOR AND USE THEREOF
#9 | 2024-03-21Model Training Method, Image Edge Detection Method, and Multi-Sensor Calibration Method
#10 | 2021-05-06Cleaning agent and preparation method and use thereof
#11 | 2019-12-05Leveling agent, metal plating composition containing same, preparation method therefor and use thereof
#12 | 2016-06-30A METHOD FOR MICROVIA FILLING BY COPPER ELECTROPLATING WITH TSV TECHNOLOGY FOR 3D COPPER INTERCONNECTION AT HIGH ASPECT RATIO
#13 | 2016-06-16Additive for reducing voids after annealing of copper plating with through silicon via
#14 | 2016-06-16Additive C capable of changing microvia-filling method by TSV copper plating, and electroplating solution containing same
1561698 ⎘