Coppell, Texas
United States
17
2016-06-23
The entities that hold a legal rights for patent applications filed by inventor Zeng Kejun:
Kejun Zeng from Coppell, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Corrosion-resistant copper bonds to aluminum
#2 | 2012-01-05CORROSION-RESISTANT COPPER-TO-ALUMINUM BONDS
#3 | 2011-07-21Stable Gold Bump Solder Connections
#4 | 2011-05-12Stable gold bump solder connections
#5 | 2010-09-02Electromigration-Resistant Flip-Chip Solder Joints
#6 | 2009-12-03Structure and Method for Reliable Solder Joints
#7 | 2009-04-09Stable gold bump solder connections
#8 | 2008-10-16Electromigration-Resistant Flip-Chip Solder Joints
#9 | 2008-04-10Gold-Tin Solder Joints Having Reduced Embrittlement
#10 | 2006-11-30Solder joints for copper metallization having reduced interfacial voids
#11 | 2006-05-11Method and structure to reduce risk of gold embrittlement in solder joints
#12 | 2006-02-23Thermal fatigue resistant tin-lead-silver solder
#13 | 2005-12-15Pre-doped reflow interconnections for copper pads
#14 | 2005-09-15Method of semiconductor device assembly including fatigue-resistant ternary solder alloy
#15 | 2005-07-28Method and structure to reduce risk of gold embrittlement in solder joints
#16 | 2005-04-07Connection site coating method and solder joints
#17 | 2005-03-15Controlling interdiffusion rates in metal interconnection structures
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