Murphy, Texas
United States
13
2026-06-11
The entities that hold a legal rights for patent applications filed by inventor Nangia Amit Sureshkumar:
Amit Sureshkumar Nangia from Murphy, US has applied for patents for these inventions. The list has both pending applications and granted patents:
FLIP CHIP SEMICONDUCTOR DEVICE PACKAGE WITH MOLD COMPOUND SEAL
#2 | 2023-03-30Flip chip semiconductor device package with mold compound seal
#3 | 2022-12-29Strain-induced shift mitigation in semiconductor packages
#4 | 2022-10-20IC having a metal ring thereon for stress reduction
#5 | 2022-08-04Semiconductor device package with reduced stress
#6 | 2022-06-30Strain-induced shift mitigation in semiconductor packages
#7 | 2021-09-23SEMICONDUCTOR DEVICE PACKAGE WITH REDUCED STRESS
#8 | 2021-06-17IC having a metal ring thereon for stress reduction
#9 | 2020-02-06Semiconductor package with filler particles in a mold compound
#10 | 2019-06-27Semiconductor package with filler particles in a mold compound
#11 | 2019-06-06Semiconductor package with a wire bond mesh
#12 | 2018-08-16Semiconductor package with a wire bond mesh
#13 | 2016-06-23Corrosion-resistant copper bonds to aluminum
1573036 ⎘