Del Mar, California
United States
49
2019-01-03
The entities that hold a legal rights for patent applications filed by inventor Kim Daeik Daniel:
Daeik Daniel Kim from Del Mar, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Segmented thermal and RF ground
#2 | 2018-12-27Low DC resistance and high RF resistance power amplifier choke inductor
#3 | 2018-11-01Power amplifier with RF structure
#4 | 2018-11-01Inductor with embraced corner capture pad
#5 | 2018-08-09WIRE-BOND CAGE IN CONFORMAL SHIELDING
#6 | 2018-06-21Passive device assembly for accurate ground plane control
#7 | 2018-05-24Passive-on-glass (POG) device and method
#8 | 2018-02-15Semiconductor assembly and method of making same
#9 | 2018-02-15Land grid array (LGA) packaging of passive-on-glass (POG) structure
#10 | 2018-02-01Stepped-width co-spiral inductor structure
#11 | 2017-12-28Stacked substrate inductor
#12 | 2017-12-28EXPOSED SIDE-WALL AND LGA ASSEMBLY
#13 | 2017-12-28INLINE KERF PROBING OF PASSIVE DEVICES
#14 | 2017-12-28Two-dimensional structure to form an embedded three-dimensional structure
#15 | 2017-11-23Double-sided circuit
#16 | 2017-11-23Passive components implemented on a plurality of stacked insulators
#17 | 2017-11-23Apparatus with 3D wirewound inductor integrated within a substrate
#18 | 2017-11-16Tunable matching network
#19 | 2017-10-05LC filter layer stacking by layer transfer to make 3D multiplexer structures
#20 | 2017-09-28Passive device assembly for accurate ground plane control
#21 | 2017-08-03Open-passivation ball grid array pads
#22 | 2017-07-13Skewed co-spiral inductor structure
#23 | 2017-06-29Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter
#24 | 2017-06-22MIM capacitor and method of making the same
#25 | 2017-05-18Encapsulation of acoustic resonator devices
#26 | 2017-05-18Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications
#27 | 2017-05-11METAL-INSULATOR-METAL (MIM) ARRAY FOR INTEGRATED RADIO FREQUENCY (RF) FILTER
#28 | 2017-05-11Solenoid inductor
#29 | 2017-05-04High quality factor capacitors and methods for fabricating high quality factor capacitors
#30 | 2017-04-27Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuits
#31 | 2017-04-20High performance inductors
#32 | 2017-04-06Integrated circuits (ICs) on a glass substrate
#33 | 2017-03-23SUBSTRATE-TRANSFERRED, DEEP TRENCH ISOLATION SILICON-ON-INSULATOR (SOI) SEMICONDUCTOR DEVICES FORMED FROM BULK SEMICONDUCTOR WAFERS
#34 | 2017-03-23Wafer level package (WLP) ball support using cavity structure
#35 | 2017-03-23Integrated circuits (ICS) on a glass substrate
#36 | 2017-03-23ON-PACKAGE CONNECTOR
#37 | 2017-03-16Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications
#38 | 2017-03-16Backside coupled symmetric varactor structure
#39 | 2017-03-16Passive-on-glass (POG) device and method
#40 | 2017-03-02Substrate comprising an embedded inductor and a thin film magnetic core
#41 | 2017-02-02TUNABLE CAVITY RESONATOR
#42 | 2016-12-29FACE-UP SUBSTRATE INTEGRATION WITH SOLDER BALL CONNECTION IN SEMICONDUCTOR PACKAGE
#43 | 2016-11-22Backside coupled symmetric varactor structure
#44 | 2016-10-06SILICON-ON-INSULATOR (SOI) WAFERS EMPLOYING MOLDED SUBSTRATES TO IMPROVE INSULATION AND REDUCE CURRENT LEAKAGE
#45 | 2016-09-293D pillar inductor
#46 | 2016-09-22Nested through glass via transformer
#47 | 2016-09-01Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)
#48 | 2016-08-25THREE DIMENSIONAL (3D) ANTENNA STRUCTURE
#49 | 2016-06-23METAL-INSULATOR-METAL (MIM) CAPACITORS ARRANGED IN A PATTERN TO REDUCE INDUCTANCE, AND RELATED METHODS
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