Inventor profile of:

Yiusing HO

City:

Hong Kong

Country:

China

Published Applications:

13

Last publication date:

2016-06-30

Top Assignees for applications by Yiusing HO

The entities that hold a legal rights for patent applications filed by inventor HO Yiusing:

Recent patent applications by HO Yiusing

Yiusing HO from Hong Kong, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2016-06-30
US20160184915A1
Performing operations; transporting

Nozzle for connecting or disconnecting solder joints between head bonding pads in a hard disk drive, and laser soldering or reflowing tool with the same

#2 | 2012-10-04
US20120248077A1
Performing operations; transporting

Soldering device for forming electrical solder connections in a disk drive unit

#3 | 2012-04-26
US20120099221A1
Physics

Head stack assembly and hard disk drive with the same

#4 | 2012-03-29
US20120075741A1
Physics

Arm coil assembly, arm flexible cable assembly and disk drive unit with the same

#5 | 2011-07-21
US20110176239A1
Physics

Head stack assembly and disk drive unit with the same

#6 | 2010-12-30
US20100328820A1
Physics

Dimple forming apparatus and dimple forming method

#7 | 2009-05-14
US20090119907A1
Physics

Method for assembling a disk drive using a shipping comb

#8 | 2008-10-30
US20080266714A1
Physics

Suspension and fabricating method thereof, head gimbal assembly and disk drive device

#9 | 2008-07-03
US20080158726A1
Physics

Disk drive unit and ramp tool for assembling the same

#10 | 2007-07-26
US20070171578A1
Physics

Head stack assembly, manufacturing method thereof, and disk drive unit

#11 | 2006-06-08
US20060119979A1
Physics

Method of assembling a disk drive unit via a ramp tool

#12 | 2006-02-23
US20060039087A1
Physics

Head stack assembly and manufacturing method thereof, and disk drive unit using the same

#13 | 2005-12-29
US20050286168A1
Physics

Drive unit and manufacturing method thereof

InventorID:

1576072 ⎘