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Inventor profile of:

Benjamin Linfield

City:

Raymond, Ohio

Country:

United States

Published Applications:

1

Last publication date:

2016-07-14

Top Assignees for applications by Benjamin Linfield

The entities that hold a legal rights for patent applications filed by inventor Linfield Benjamin:

HONDA MOTOR CO., LTD. 1 Tokyo, Japan
YAMASHITA RUBBER CO., LTD. 1 Fujimino, Japan

Recent patent applications by Linfield Benjamin

Benjamin Linfield from Raymond, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2016-07-14

US20160201756A1

Mechanical engineering

Mount apparatus

InventorID:

1591716 ⎘