Inventor profile of:

Yaping Zhou

City:

Austin, Texas

Country:

United States

Published Applications:

14

Last publication date:

2013-03-28

Top Assignees for applications by Yaping Zhou

The entities that hold a legal rights for patent applications filed by inventor Zhou Yaping:

Recent patent applications by Zhou Yaping

Yaping Zhou from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-03-28
US20130075148A1
Electricity

Reducing impedance discontinuity in packages

#2 | 2012-06-07
US20120138349A1
Electricity

System to improve coreless package connections

#3 | 2011-06-23
US20110147044A1
Electricity

System to improve coreless package connections

#4 | 2010-01-21
US20100017158A1
Physics

GENERATING WORST CASE BIT PATTERNS FOR SIMULTANEOUS SWITCHING NOISE (SSN) IN DIGITAL SYSTEMS

#5 | 2009-12-10
US20090302874A1
Physics

METHOD AND APPARATUS FOR SIGNAL PROBE CONTACT WITH CIRCUIT BOARD VIAS

#6 | 2009-07-30
US20090189713A1
Electricity

Voltage controlled on-chip decoupling capacitance to mitigate power supply noise

#7 | 2009-05-21
US20090126983A1
Electricity

Method and apparatus to reduce impedance discontinuity in packages

#8 | 2008-08-07
US20080189090A1
Physics

System and Method for Determining a Guard Band for an Operating Voltage of an Integrated Circuit Device

#9 | 2007-04-10
US11424613
-

Impedane measurement of chip, package, and board power supply system using pseudo impulse response

#10 | 2006-07-27
US20060163716A1
Electricity

Semiconductor package with crossing conductor assembly and method of manufacture

#11 | 2006-03-30
US20060065966A1
Electricity

Semiconductor package with crossing conductor assembly and method of manufacture

#12 | 2005-09-01
US20050189643A1
Electricity

Semiconductor package with crossing conductor assembly and method of manufacture

#13 | 2005-06-09
US20050122198A1
Electricity

Inductive device including bond wires

#14 | 2005-04-28
US20050087856A1
Electricity

Electromagnetic noise shielding in semiconductor packages using caged interconnect structures

InventorID:

159642 ⎘