Hsinchu
Taiwan
99
2025-07-31
The entities that hold a legal rights for patent applications filed by inventor Yang Chi-Ming:
Chi-Ming Yang from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#2 | 2024-10-24PHOTORESIST LAYER SURFACE TREATMENT, CAP LAYER, AND METHOD OF FORMING PHOTORESIST PATTERN
#3 | 2024-07-25Semiconductor lithography system and/or method
#4 | 2024-06-27SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF
#5 | 2023-11-23Method of manufacturing a semiconductor device
#6 | 2023-11-16Method of manufacturing a semiconductor device
#7 | 2023-11-16Photoresist for semiconductor fabrication
#8 | 2023-10-12Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern
#9 | 2023-08-10METROLOGY METHOD
#10 | 2023-03-09Method of manufacturing a semiconductor device and pattern formation method
#11 | 2022-12-01Method for polishing semiconductor substrate
#12 | 2022-12-01Organometallic cluster photoresists for EUV lithography
#13 | 2022-11-17Methods of manufacturing semiconductor packaging device and heat dissipation structure
#14 | 2022-11-17Method for manufacturing semiconductor structure
#15 | 2022-11-10Semiconductor lithography system and/or method
#16 | 2022-11-03CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE
#17 | 2022-08-18Heat dissipation structure, semiconductor packaging device, and manufacturing method of the semiconductor packaging device
#18 | 2022-05-26Probing system for discrete wafer
#19 | 2022-03-31In-Situ Deposition and Densification Treatment for Metal-Comprising Resist Layer
#20 | 2022-03-31Photoresist for semiconductor fabrication
#21 | 2022-03-31Photoresist for semiconductor fabrication
#22 | 2022-01-06Method of manufacturing a semiconductor device and pattern formation method
#23 | 2021-11-25Semiconductor lithography system and/or method
#24 | 2021-09-30Method of manufacturing a semiconductor device
#25 | 2021-09-30Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern
#26 | 2021-09-30Method of manufacturing a semiconductor device
#27 | 2021-09-30Method of manufacturing a semiconductor device
#28 | 2021-08-26Method for forming a semiconductor structure using dehydrating chemical, and method for forming a semiconductor structure
#29 | 2021-07-22Wafer polishing head, system thereof, and method using the same
#30 | 2021-03-25Organometallic cluster photoresists for EUV lithography
#31 | 2021-02-11Device and methods for chemical mechanical polishing
#32 | 2020-12-24Method for manufacturing semiconductor structure
#33 | 2020-12-10Ellipsometer and method for estimating thickness of film
#34 | 2020-05-28Method for forming a semiconductor structure using dehydrating chemical, and method for forming a semiconductor structure
#35 | 2020-05-143D IC bump height metrology APC
#36 | 2020-04-30Apparatus and method for generating an electromagnetic radiation
#37 | 2020-04-16Apparatus and method for generating an electromagnetic radiation
#38 | 2020-03-05Ellipsometer and method for estimating thickness of film
#39 | 2020-02-27Semiconductor devices employing a barrier layer
#40 | 2020-02-27Metrology method
#41 | 2020-02-06Light generation system using metal-nonmetal compound as precursor and related light generation method
#42 | 2020-02-06Apparatus and methods for chemical mechanical polishing
#43 | 2020-01-30Method of manufacturing semiconductor structure
#44 | 2019-12-12Apparatus and methods for chemical mechanical polishing
#45 | 2019-12-05Apparatus and method for generating an electromagnetic radiation
#46 | 2019-05-093D IC bump height metrology APC
#47 | 2018-06-14Semiconductor manufacturing apparatus and method thereof
#48 | 2018-04-053D IC bump height metrology APC
#49 | 2018-01-18Defect inspection and repairing method and associated system and non-transitory computer readable medium
#50 | 2018-01-18Composition for chemical mechanical polishing and method for reducing chemical mechanical polishing surface defects
#51 | 2017-12-21Apparatus for particle cleaning
#52 | 2017-10-26Solid precursor delivery method using liquid solvent for thin film deposition
#53 | 2017-08-22Reactive radical treatment for polymer removal and workpiece cleaning
#54 | 2017-07-20Pellicle and method for manufacturing the same
#55 | 2017-06-01pH-adjuster free chemical mechanical planarization slurry
#56 | 2017-03-09Gigasonic cleaning techniques
#57 | 2017-01-193D IC bump height metrology APC
#58 | 2016-09-15Fine temperature controllable wafer heating system
#59 | 2016-06-23Apparatus and process of electro-chemical plating
#60 | 2016-06-02Hard mask removal scheme
#61 | 2016-05-19Method of planarizing a wafer
#62 | 2016-03-17Method of manufacturing cerium dioxide powder and cerium dioxide powder
#63 | 2016-01-14Bottom-up PEALD proces
#64 | 2015-12-10Chemical mechanical polishing (CMP) platform for local profile control
#65 | 2015-09-24Ion beam dimension control for ion implantation process and apparatus, and advanced process control
#66 | 2015-09-10Hard mask removal scheme
#67 | 2015-05-28Metrology device and metrology method thereof
#68 | 2015-04-23Method of selectively removing silicon nitride and single wafer etching apparatus thereof
#69 | 2015-04-23Method of selectively removing silicon nitride and etching apparatus thereof
#70 | 2015-04-16Semiconductor manufacturing apparatus and method thereof
#71 | 2015-03-12Device manufacturing cleaning process using vaporized solvent
#72 | 2015-01-08Systems and methods for fabricating and orienting semiconductor wafers
#73 | 2014-10-16Beam monitoring device, method, and system
#74 | 2014-09-18Method and apparatus for controlling beam angle during ion implantation of a semiconductor wafer based upon pressure
#75 | 2014-09-18Fine temperature controllable wafer heating system
#76 | 2014-08-28Layer by layer electro chemical plating (ECP) process
#77 | 2014-08-21Substrate rapid thermal heating system and methods
#78 | 2014-08-14Bottom-up PEALD process
#79 | 2014-08-07High throughput CMP platform
#80 | 2014-07-31In-situ charging neutralization
#81 | 2014-07-24Wafer processing system using multi-zone chuck
#82 | 2014-06-19Apparatus and method of cleaning wafers
#83 | 2014-06-12Metal conductor chemical mechanical polish
#84 | 2014-06-12System and method of cleaning FOUP
#85 | 2014-06-05N/P metal crystal orientation for high-k metal gate Vt modulation
#86 | 2014-05-29Multi-point chemical mechanical polishing end point detection system and method of using
#87 | 2014-04-03Method of identifying airborne molecular contamination source
#88 | 2013-11-07Ion beam dimension control for ion implantation process and apparatus, and advanced process control
#89 | 2013-10-24Methods for fabricating and orienting semiconductor wafers
#90 | 2013-10-17System and method of ion beam source for semiconductor ion implantation
#91 | 2013-10-10System and method of ion neutralization with multiple-zoned plasma flood gun
#92 | 2013-09-19Manufacture and method of making the same
#93 | 2013-08-15CMP pad cleaning apparatus
#94 | 2013-07-04Wafer processing method and system using multi-zone chuck
#95 | 2013-06-06Ion implantation with charge and direction control
#96 | 2013-03-28Beam monitoring device, method, and system
#97 | 2013-02-28Method and structure for advanced semiconductor channel substrate materials
#98 | 2012-07-19Frame cell for shot layout flexibility
#99 | 2008-08-14Method for fabricating nitrided oxide layer
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