Mountain View, California
United States
48
2026-04-09
The entities that hold a legal rights for patent applications filed by inventor Lutz Markus:
Markus Lutz from Mountain View, US has applied for patents for these inventions. The list has both pending applications and granted patents:
MEMS Resonator
#2 | 2025-10-16Stacked-die MEMS resonator
#3 | 2025-08-19Resonant elements and oscillators
#4 | 2025-01-16STACKED-DIE MEMS RESONATOR
#5 | 2025-01-09Suspension for Resonators and MEMS Devices
#6 | 2025-01-02Ovenized MEMS
#7 | 2024-09-17MEMS resonator with colocated temperature sensor
#8 | 2024-02-15Non-Lid-Bonded MEMS Resonator With Phosphorus Dopant
#9 | 2024-02-13MEMS resonator with beam segments having predefined angular offset to each other and to resonator silicon crystal orientation
#10 | 2024-01-09Time module apparatus for use with fixed-beacon time transfer system
#11 | 2024-01-04MICROMECHANICAL STRUCTURE WITH BONDED COVER
#12 | 2023-12-07MEMS resonator system
#13 | 2023-11-07Multi-die integrated circuit package
#14 | 2023-09-26MEMS resonator with co-located temperature sensor
#15 | 2022-11-10Ovenized MEMS
#16 | 2022-11-10Stacked-die MEMS resonator
#17 | 2022-01-04Fixed-beacon time transfer system
#18 | 2021-07-22Microelectromechanical structure with bonded cover
#19 | 2021-06-17Stacked-die MEMS resonator
#20 | 2020-12-10Manufacturing of integrated circuit resonator
#21 | 2020-06-11Ovenized MEMS
#22 | 2020-03-12Encapsulated microelectromechanical structure
#23 | 2019-11-12Dual-resonator semiconductor die
#24 | 2019-09-26Package structure for micromechanical resonator
#25 | 2019-02-21Encapsulated microelectromechanical structure
#26 | 2018-08-30Frequency compensated oscillator design for process tolerances
#27 | 2018-08-30Frequency compensated oscillator design for process tolerances
#28 | 2018-06-07Low-profile stacked-die MEMS resonator system
#29 | 2018-02-15Encapsulated microelectromechanical structure
#30 | 2017-09-26Laterally-doped MEMS resonator
#31 | 2017-07-04Temperature insensitive resonant elements and oscillators and methods of designing and manufacturing same
#32 | 2017-04-13Encapsulated microelectromechanical structure
#33 | 2017-03-30Microelectromechanical resonator
#34 | 2017-02-02Stacked-die MEMS resonator system
#35 | 2016-06-16Encapsulated microelectromechanical structure
#36 | 2015-05-07Low-profile stacked-die MEMS resonator system
#37 | 2015-02-12Wafer encapsulated microelectromechanical structure
#38 | 2015-02-05Stacked die package for MEMS resonator system
#39 | 2014-12-23MEMS device and method of manufacturing same
#40 | 2013-10-31Integrated getter area for wafer level encapsulated microelectromechanical systems
#41 | 2013-10-24Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same
#42 | 2013-05-02Methods for trapping charge in a microelectromechanical system and microelectromechanical system employing same
#43 | 2013-03-28Stacked die package for MEMS resonator system
#44 | 2011-09-22Stacked die package for MEMS resonator system
#45 | 2011-08-18MEMS resonator array structure and method of operating and using same
#46 | 2011-01-27MEMS resonator structure including regions with different densities and method
#47 | 2009-06-18MEMS resonator structure and method
#48 | 2009-06-18MEMS resonator array structure and method of operating and using same
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