DaeSup Kim

City:

SujungGu

Country:

South Korea

Published Applications:

Last publication date:

2013-03-28

Top Assignees for applications by DaeSup Kim

The entities that hold a legal rights for patent applications filed by inventor Kim DaeSup:

DaeSup Kim from SujungGu, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Integrated circuit packaging system with chip stacking and method of manufacture thereof

InventorID:

161071 ⎘