Tetsuya Jigami

City:

Hiroshima

Country:

Japan

Published Applications:

Last publication date:

2013-06-06

Top Assignees for applications by Tetsuya Jigami

The entities that hold a legal rights for patent applications filed by inventor Jigami Tetsuya:

Mitsubishi Rayon Co., Ltd. 2 Tokyo, Japan
MITSUBISHI CHEMICAL CORPORATION 1 Tokyo, Japan

Recent patent applications by Jigami Tetsuya

Tetsuya Jigami from Hiroshima, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-06-06

US20130140744A1

Performing operations; transporting

Method for producing product having uneven microstructure on surface thereof

#2 | 2013-03-28

US20130075962A1

Performing operations; transporting

Method for producing product having uneven microstructure on surface thereof, mold release treatment method, and active energy ray curable resin composition for mold surface release treatment

InventorID:

161157 ⎘